HP 250 Epoxy, 50 mL, Dev-Pak, Straw - Devcon 14315
- High-performance, toughened structural adhesive with outstanding environmental, impact and chemical resistance
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- Temp. Range [Max]: 250 °F
- Temp. Range [Min]: -67 °F
- Adhesive Tensile Shear: 3,200 psi
- Applicable Materials: Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
- Applications: Multi-Purpose
- Base Type: Epoxy
- Capacity Vol. [Nom]: 50 mL
- Chemical Compound: Epoxy
- Color: Straw
- Elongation [Nom]: 0.25
- Fix Cure Time @ Temp.: 6 h @ 72 °F
- Full Cure Time @ Temp.: 7 d @ 72 °F
- Hardness [Nom]: 78 Shore D
- Dielectric Strength: 490 V/mil
- Height [Nom]: 3 1/4 in
- Length [Nom]: 7 1/4 in
- Material: Thixotropic Paste
- Tensile Strength [Nom]: 3,200 psi
- Viscosity [Nom]: 105,000 cP
- Width [Nom]: 6 in
- Working Time [Nom]: 65 min
- Odor/Scent: Low
- Packing Type: Dev-Pak
- Physical Form: Solid
- Ratio: 8.40277777777778E-02
- Resistance: Chlorinated Solvents; Kerosene; Moisture; Water; Weather
- Type: Adhesive
- Usage: Structural Bonding
- Country of Origin: US
WARNING: This product contains a chemical known to the State of California to cause cancer. For more information, go to www.P65Warnings.ca.gov.
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